Influence of Cu Addition on the Transient Creep Characteristics of Sn–9Zn-1.5Ag Solder Alloy
Abstract
Abstract
This paper develops methods to explore the influence of Cu increments on disfigurement temperature T and
the applied stress σ on transient creep characteristics. The materials used in the present study are Tin-9Zinc1.5Silver and Tin-9 Zinc-1.5 Silver-0.7Copper alloys. Creep tests are performed under five different stresses
ranging from 15.22 to 23.35 MPa and 4 unlike experimentation temperatures from 333 to 393 K near the
transformation temperatures. The coefficients β and n for transient creep is evidently depended on the creep
test conditions, T and stress σ. The coefficients β is reduced by growing T and/or load while n is raised by rising
T regardless of the applied stress σ. The two samples presented extra contained phases of the intermetallic
compound IMCs, Ag3Sn Agang, during solidification. An important refinement in the creep resistance is
recognized by supplement 0.7Cu to the ternary Tin-9 Zinc-1.5 Silver solder Alloy. I . e. Tin-9 Zinc-1.5 Silver-0.7
Copper alloy is more strengthening than Tin-first alloy.
